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Microduct Product
- Microduct Product
- Direct Buried Microduct
Direct Buried Microduct
DIRECT BURIED APPLICATION requires either by trenching or HDD method.
With all the configuration of Direct Buried Application, the microduct can be directly deployed on the ground
surface without any additional ducting pipe needed.
The Characteristics of Direct Buried Application
- Robust, highly resistant to crushing and external impact.
- Suitable for all environments, (green or brown fields.)
- Has ribbed or smooth inner surface that enables cable blowing.
- Future Proof, can accommodate more cables.
- Long life time, over 30 years.
- Temperature resistance.
- Requires less connection.
Installation Method
KNET has met and maintains the rigorous standards required to become a Certified ISO 9001, ISO 14001 and TL9000 manufacturer.
KNET Microduct Assemblies has been rigorously tested by Telcordia Technologies and found to be compliant to Telcordia GR-3155-CORE.
KNET Microduct Assemblies has been rigorously tested by Telcordia Technologies and found to be compliant to Telcordia GR-3155-CORE.
